(1)  Chen, CH and Huang, CY, ‘The synergy of QFD and TRIZ for solving EMC problems in electrical products-A case study for the Notebook PC’, Journal of Industrial and Production Engineering. (2015,3.30, accepted)
(2)  Huang, CY, Lin, YH and Tsai, PF, 2015 March, ‘Developing a rework process for underfilled electronics components via integration of TRIZ and cluster analysis’, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 5, No. 3, pp. 422-438 (SCI, IF1.236) 
(3)  Huang, CY, 2015 February, ‘Innovative parametric design for environmentally conscious adhesive dispensing process’, Journal of Intelligent Manufacturing, Vol. 26, No. 1, pp. 1-12. (SCI, IF0.859)
(4)  Chang MT and Huang, CY, ‘A study on introducing supplier process capacity database into tolerance design’, Journal of Industrial and Production Engineering, (2014 October, Published online, EI)
(5)  Huang, CY, Palacios, C, Hong, Z.S, Chen, CH, 2014 August, ‘Parametric design of the adhesive dispensing process with multiple quality characteristics’, Journal of Quality, Vol. 21, No. 4, pp 233-245. (EI)
(6)  Huang, CY and Huang, HH, 2014 July, ‘Process optimization of SnCuNi soldering material using artificial parametric design’, Journal of Intelligent Manufacturing, Vol. 25, No. 4, pp. 813-823. (SCI, IF0.859) 
(7)  Huang, CY, Lin, Y.H. and Huang, E, 2014 January, ‘DOM products: activation energy estimation and reliability assessment’, Applied Mechanics and Materials, Vol. 470, pp. 781-784. (EI)
(8)  Huang, CY, 2013 September ‘Package-on-package assembly yield assessment in the ODM/EMS environment using Monte Carlo simulation’, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 3, No. 9, pp. 1611-1620. (SCI, IF: 1.261)
(9)  Lin, SW, Ying, KC, Huang, CY, 2013 August ‘Minimizing makespan in distributed permutation flowshops using a modified iterated greedy algorithm’, International Journal of Production Research, Vol. 51, No. 16, pp. 5029-5038. (SCI,IF1.115) 
(10) Yeh, CH, Huang, CY, Wu, F. C, 2013 March ‘A breakthrough product R&D model by using the integration of four-phase QFDs and TRIZ’, International Journal of Modelling, Identification and Control, Vol. 18, No. 3, pp. 199-210. (EI) 
(11) Huang, CY, Lin, YH, 2013 March ‘Applying CHAID algorithm to investigate critical attributes of void formation in QFN assembly’, Soldering & Surface Mount Technology, Vol. 25, No. 2, pp. 117-127. (SCI, EI, IF:0.314)
(12)Huang, CY, 2013 January, ‘Reliability assessment of RFID reader through prognostics and health management’, Microelectronics Reliability, Vol. 53, pp. 136-144. (SCI, IF:1.167)
(13)Lin, SW, Ying, KC, Huang, CY, 2013 January ‘Multiprocessor task scheduling in multistage hybrid flowshops: A hybrid artificial bee colony algorithm with bi-directional planning’, Computers & Operations Research, Vol. 40, pp. 1186-1195 (SCI, IF:1.72) 
(14)Huang, CY, 2012 November, ‘Intelligent Parametric Design for a Robust LED Encapsulation Process’, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No 11, pp. 1919-1927. (SCI, IF:0.977)
(15)Lin, SW, Huang, CY, Lu CC and Ying, KC, 2012October, ‘Minimizing total flow time in permutation flowshop environment’, International Journal of Innovative Computing, Information and Control, Vol.8, No. 8, pp. 1-14 (SCIExpanded, EI)
(16)  Hu, CM, Yeh, CH, Huang, Jay CY, 2012 Jun.;‘Innovative Design Process for Intelligent Patient Bed by Using Synergy TRIZ and QFDs’, Advanced Materials Research, Vols.538-541, pp 2901-2922. (EI)
(17)Huang, CY, Huang, HH, and Ying, KC, 2012 Mar.;‘Sn–Cu–Ni Soldering Process Optimization Using Multivariate Analysis’, IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, No 3, pp. 527-535. (SCI,IF:0.977)
(18) Hu, CM, Yeh, CH, Huang, Jay CY, 2012 Feb.; ‘An innovative design for high performance control valve by using the synergy of QFD and TRIZ methods’, Advanced Materials Research, Vols.468-471, pp 339-354. (EI)
(19)Huang, CY, Lin, YH, Ying, KC, Ku, CL, 2011 Sep; ‘The solder paste printing process: critical parameters, defect scenarios, specifications, and cost reduction’, Soldering & Surface Mount Technology, Vol. 23, No 4, pp. 211-223 (SCI, EI,IF:0.659)
(20) Huang, CY, Huang, HH, 2011 Jul; ‘Comparison of results from empirical ALT test to CAE simulation for wireless clients’, Microelectronics International, Vol. 28, No 3, pp. 51-59 (SCI, EI,IF:0.468)
(21) Yeh, CH, *Huang, Jay CY, Yu, CK, 2011 Jun; ‘Integration of Four-phase QFD and TRIZ in Product R&D – A Notebook Case Study’; Research in Engineering Design, Vol. 22, No 3, pp. 125-141 (SCI, EI, IF:1.944) * Corresponding author
(22)Huang, CY, 2010 Oct; ‘Reducing Solder Paste Inspection in Surface Mount Assembly through Mahalanobis-Taguchi Analysis’; IEEE Transactions on Electronics Packaging Manufacturing, Vol.33, No4, pp.265-274. (SCI, EI,IF:1.160) (國科會計畫編號NSC NSC93-2213-E-211-010.)
(23)Yeh, CH, Wu, FC, Ji, WL, Huang, CY; 2010 May; ‘A Wavelet-Based Approach in Detecting Visual Defects on Semiconductor Wafer Dies’; IEEE Transactions on Semiconductor Manufacturing, Vol.23, No2, pp.284-292. (SCI, EI,IF:1.007)
(24)Huang, CY, Li, MS, Ku, CL, Hsieh, HC; 2009 August; ‘Chemical Characterization of Failures And Process Materials for Microelectronics Assembly’; Microelectronics International, Vol.26, No3, pp.41-48. (SCI, EI,IF:0.471)
(This paper has been chosen as a Highly Commended Award Winner at the Literati Network Awards for Excellence 2010.)
(25)黃乾怡,蔡明峰,黃匯華;2009 June應用資料包絡分析法(DEA)於六標準差專案之績效評估技術學刊,第24卷第2期,pp.117~130.
(26) Ying, KC, Lin, SW, Huang, CY; 2009 April ; ‘Sequencing Single-machine Tardiness Problems with Sequence Dependent Setup Times Using an Iterated Greedy heuristic’; Expert Systems With Applications, Vol.36, Issue 3, Part 2, , pp. 7087-7092 (SCI, EI,IF:2.596)
(27)黃乾怡,簡子旻; 2007 ;‘無鉛製程電路板材料之發展與應用電子月刊;11月專輯封裝技術,第十三卷第11期,PP.139-151
(30)  Huang, CY; 2004; ‘The Reliability Assessment of Flip Chip Component’; Microelectronics International, Vol.21, No2, pp.10-15. (SCI, EI,2003資料庫沒有)
(31)黃乾怡,謝至傑;2004 July‘IC元件XY平面及Z方向置放良率分析;中國工業工程學會學刊,第21卷第4期,pp.339-348.(EI)
(32)黃乾怡,豐川弘盛;2004 November無針腳型CSP元件組裝製程與可靠度分析;電子與材料,工業技術研究院工業材料研究所,第24期,pp.98-103
(34)Huang, CY; 2002; ‘The Investigation of The Capillary Flow of Underfill Materials’; Microelectronics International, Vol.19, No1, pp.23-29. (SCI, EI,2001資料庫沒有)
(35)黃乾怡 & Westby, G.2000 March覆晶元件助銲劑塗佈過程探討;覆晶及銅晶片構裝聯盟會刊,工業技術研究院電子工業研究所, pp.26-29
(36)Huang, CY, Srihari, K, & Borgesen, P.; 2000; ‘Optimization of The Substrate Preheat Temperature for the Encapsulation of Flip Chip Devices’; The International Journal of Advanced Manufacturing Technology; Vol.16, Part 1; pp.55-64. (SCI, EI,IF:0.33)
(37)Huang, CY, Srihari, K, McLenaghan, A.J, & Westby, G.R.; 1996 March; ‘The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis’; Journal of Electronic Manufacturing, Vol. 6, No. 1; pp.23-37. (SCI, EI)

Copyright©2014 國立臺北科技大學

10608 臺北市忠孝東路三段一號


(宏裕科技研究大樓 933, 632, 534)

Tel: (886-2)2771-2171 #2331, 2384

E-mail: emqtntut@gmail.com