• 本聯盟以電子製造與品質技術領域研究為主軸

  • 配合技術理論導向與產業研發實務經驗

  • 設備操作與教學

  • 專業諮詢與訪視

  • 研究探討與提案規劃

  • 主、協辦技術研討會

  • 榮獲科技部產學績效優良獎

聯盟介紹

本聯盟以電子製造與品質技術領域研究為主軸,配合技術理論導向與產業研發實務經驗,垂直整合及橫向交流方式。

聯盟研究成果/資源

現有成果列表,包含已發表論文期刊、產學成合作成功案例、專利與技術,以及設備介紹。

聯盟活動

本聯盟活動照片 / 成果展現等。

QFN Package Board Level Reliability Project

Sign up for this project by July 31, 2015
Call for Participation

Two sessions will be held.  Please register for the session you wish to attend.

  • July 16, 2015, 10:00 a.m. JST (Japan)
    Register here for this webinar.  Once approved you will receive a confirmation email.
     
  • July 16, 2015, 11:00 a.m. EDT (North America)
    Register here for this webinar.  Once approved, you will receive a confirmation email.

Statement of Work and Project Statement

Background

There are an increasing number of IC devices being packaged in no-lead packages such as the Quad Flat No-Lead (QFN) or Micro-Lead Frame (MLF) packages. These packages initially were developed as a low form factor package for hand-held consumer electronic devices. They have additional advantages such as minimizing board real estate usage, excellent thermal management characteristics, potentially better electrical performance, and generally lower cost than competitive packaging. In very recent years, the usage of QFN packages has expanded into telecom and automotive applications, where long term board level reliability (BLR) requirements for thermal fatigue resistance are more demanding compared to consumer applications.

Failure resulting from solder thermal fatigue is a principal concern due to the inherently high coefficient of thermal expansion (CTE) mismatch, low solder standoff, and non-compliant peripheral interconnects of the non-leaded package. These packages also present solder assembly challenges that can impact BLR further. The packaging technology is evolving in the direction of larger body size, finer pitch, and higher pin count, all of which increase reliability risks and assembly challenges.

QFN package usage continues to be dominated by high-volume manufacturers of consumer electronics, and much of the existing reliability test data have been generated to address those requirements. Consequently, thermal cycling data are lacking for characterizing longer product lifetimes and more aggressive use environments, particularly for thicker printed circuit boards typical of higher reliability applications.

Project Focus

The focus of this project is to isolate the effects of several key parameters on thermal cycle reliability of a large body QFN package. To accomplish this, a test vehicle will be designed to incorporate several design features, including the ability to evaluate effect of body size, die size, and pitch. Selected variables will be evaluated using a phased approach to close information gaps and minimize the complexity of each test. See the SOW for a description of Phase 1 work and suggestions for work in subsequent phases.

Steps for Joining the Project

Please note: iNEMI membership is required to participate in this project. The period for becoming a founding member for this project will close on July 31, 2015.

For iNEMI members:

  • Complete and sign the project statement
  • Fax the completed statement(s) to +1 (703) 834-2735 or scan and email to Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它

For non-members:

  • Discuss annual membership fees with Bill Bader in North America (Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它), Haley Fu in Asia (Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它), or Grace O'Malley in Europe (Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它).
  • Complete the iNEMI membership applicationWhy join?
  • Fax the completed documents to +1 (703) 834-2735 or scan and email to Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它
  • Complete and sign the project statement
  • Fax the completed statements to +1 (703) 834-2735 or scan and email to Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它.

For Additional Information

Masahiro Tsuriya
Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它

 

Copyright©2014 國立臺北科技大學

10608 臺北市忠孝東路三段一號

先進製程品管實驗室

(宏裕科技研究大樓 933, 632, 534)

Tel: (886-2)2771-2171 #2331, 2384

E-mail: emqtntut@gmail.com