• 本聯盟以電子製造與品質技術領域研究為主軸

  • 配合技術理論導向與產業研發實務經驗

  • 設備操作與教學

  • 專業諮詢與訪視

  • 研究探討與提案規劃

  • 主、協辦技術研討會

  • 榮獲科技部產學績效優良獎

聯盟介紹

本聯盟以電子製造與品質技術領域研究為主軸,配合技術理論導向與產業研發實務經驗,垂直整合及橫向交流方式。

聯盟研究成果/資源

現有成果列表,包含已發表論文期刊、產學成合作成功案例、專利與技術,以及設備介紹。

聯盟活動

本聯盟活動照片 / 成果展現等。

INEMI2017.07.01

 

Call for Participation: Quantify Impact of Board Design and Process Control on SMT Performance

July 1, 2015 to July 2, 2015

This kick-off meeting will review the background that led to this proposed project, and discuss project scope, objectives and key variables to be considered. Regular meetings will be organized to define the detailed statement of work (SOW).

This webinar is free and open to industry. Registration is required to participate. One session will be held:

●Wednesday, July 3, 5:00 p.m. PDT (North America)
●Thursday, July 2, 8:00 a.m. CST (China)

Background

This new initiative was proposed by iNEMI members and was selected to move forward based on our industry survey.

 

Warpage issues can significantly affect SMT yield. iNEMI has ongoing projects focusing on package warpage characterization; however, the impact of board design, warpage, paste print and process temperature on SMT yield is not well understood. This initiative proposes to study those gaps and investigate board warpage and its correlation with SMT yield.

For more information(download PDF).

We expect active engagement from OEMs, ODMs, IC makers, and materials and equipment suppliers. If this is an area of interest -- and need -- for your company, please join us for this project formation meeting. Please contact Haley Fu if you have any questions and send her the appropriate contacts at your company to be involved in this new initiative.
For Additional Information

Haley Fu
Email住址會使用灌水程式保護機制。你需要啟動Javascript才能觀看它

 

 

Copyright©2014 國立臺北科技大學

10608 臺北市忠孝東路三段一號

先進製程品管實驗室

(宏裕科技研究大樓 933, 632, 534)

Tel: (886-2)2771-2171 #2331, 2384

E-mail: emqtntut@gmail.com